Features:
1. Suitable for iPhone 13/13 Pro/13 Pro Max/13 Mini
2. Snap fixed, precise positioning, constant temperature,
3. Silicone insulation, and non-slip foot pad
4. High hardness thick synthetic stone
5. Explosion-proof tin, constant temperature heating
6. One-piece pure copper positioning column to ensure uniform and stable heat transfer and heating, accurate positioning, and efficient layering of the motherboard
7. Accurate temperature, uniform heating, non-destructive repair